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Electronic Packaging and Interconnection Handbook
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McM C/Mixed Technologies and Thick Film Sensors (NATO Asi Series. Series 3, High Technology, Vol 2)
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
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Advanced Electronic Packaging : With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)
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Thermal Management Handbook: For Electronic Assemblies
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Flip Chip Technologies
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About Multichip

Touching the derivation of the name Multichip, I confess
myself, with sorrow, equally at fault. Among a multitude of opinions
upon this delicate point- some acute, some learned, some sufficiently
the reverse -- I am able to select nothing which ought to be
considered satisfactory.

Modified text originally written by Edgar Allan Poe.


Electronic Packaging and Interconnection Handbook More...	McM C/Mixed Technologies and Thick Film Sensors (NATO Asi Series. Series 3, High Technology, Vol 2) More...	Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies More...

Advanced Electronic Packaging : With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) More...	Thermal Management Handbook: For Electronic Assemblies More...	Flip Chip Technologies More...